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Created by Unknown User (astrocrg@mit.edu), last modified by Unknown User (elenarom@mit.edu) on Mar 02, 2019 14:14
CAD Changes
- Fix materials on all parts
- check diameters on Camera Enc./DAQ Enc.
- Figure out what to do with the breakout board @Andrew Adams
- Fix LE100 Cover for camera enclosure riding condition
Manufacturing
- Guard manufacturing
- LE100 Assembly
- Reprint Camera Holders
- PCB's for LEDs
- Countersink holes in forward retention ring
Concept Development
- What to do with the ADXL1001 - deleted
- Thermocouple on the forward closure?
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